TAARCOM at FMS 2025: Showcasing ISSI’s Memory Solutions

August 5–7, 2025 • Santa Clara Convention Center

At the ISSI booth: Johnny Chien, Marketing Manager

Last week, TAARCOM partnered with ISSI (Integrated Silicon Solution, Inc.) at the Future of Memory and Storage (FMS) 2025, the industry’s premier event for next-generation memory and storage technologies.

This year, AI dominated the conversation, featuring in over 60% of keynote and panel topics, underscoring just how essential advanced memory architectures have become to powering the next wave of computing.

A Global Stage for Memory Solutions

Now in its 19th year, FMS remains the largest and most inclusive gathering in the memory and storage sector. Engineers, developers, manufacturers, and industry analysts converge to explore solutions that push the boundaries of performance, efficiency, and scalability.

For ISSI, it was the perfect opportunity to showcase a proven, diverse memory portfolio. For TAARCOM, it was another chance to strengthen partnerships and connect ISSI’s solutions with the engineers and organizations who need them most.

At the ISSI Booth: DRAM, SRAM, Flash, and Real Conversations

Leading the way at the booth was Johnny Chien, ISSI’s Marketing Manager, who spent much of the event engaging with visitors, answering technical questions, and highlighting ISSI’s capabilities.

David Comerton and Johnny Chien

The TAARCOM team, including David Comerton, Mike Dominick, Diana Taylor, and Fred Manriquez, were also on hand to support conversations, meet new contacts, and share product insights with engineers, decision-makers, and industry partners.

Booth discussions often centered on DDR3, DDR4, and LPDDR4, with strong interest in ISSI’s comprehensive roadmap, including Octal Flash Memory products. One highlight was a conversation with a marketing manager from a major Silicon Valley company, who expressed strong interest in exploring new module opportunities. The team also connected with an engineering consultant affiliated with several TAARCOM customers, sparking potential collaboration on new second-source modules. While many visitors were fellow suppliers, these interactions still opened valuable opportunities for future engagement.

From left to right: Mark Selby, Esther Chen, Anand Bagchi, Isabelle Silva, Johnny Chien, Diana Taylor, Ron Kalakuntla

Beyond the Booth: What We Saw

The show floor offered plenty to take in, from cable and testing equipment that could connect to other TAARCOM partner lead, to Microchip’s large booth featuring complementary memory technologies.

But these key trends stood out across the event:

• AI Applications Everywhere - AI wasn’t limited to conference sessions; it was integrated into live demos, marketing, and system architectures throughout the show.

• Live Demos Win Attention - Real-time performance comparisons consistently drew crowds.

• CXL & Next-Gen Designs - There’s growing momentum toward architectures that make memory more active, adaptive, and central to system design.

Looking Ahead

As the industry moves further into AI-driven applications, energy-efficient data centers, and high-reliability embedded systems, TAARCOM will continue partnering with ISSI to ensure the correct memory solutions reach the right designs.